Show simple item record

Cryogenic etching of porous organosilicate low-k materials: reduction of plasma induced damage

dc.contributor.authorLeroy, F.
dc.contributor.authorTillocher, T.
dc.contributor.authorZhang, Liping
dc.contributor.authorLefaucheux, P.
dc.contributor.authorYatsuda, K.
dc.contributor.authorMaekawa, K.
dc.contributor.authorde Marneffe, Jean-Francois
dc.contributor.authorBaklanov, Mikhaïl
dc.contributor.authorDussart, R
dc.date.accessioned2021-10-22T20:26:05Z
dc.date.available2021-10-22T20:26:05Z
dc.date.issued2015
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/25530
dc.sourceIIOimport
dc.titleCryogenic etching of porous organosilicate low-k materials: reduction of plasma induced damage
dc.typeMeeting abstract
dc.contributor.imecauthorZhang, Liping
dc.contributor.imecauthorde Marneffe, Jean-Francois
dc.source.peerreviewyes
dc.source.beginpage124
dc.source.conferenceAVS 62nd International Symposium & Exhibition
dc.source.conferencedate19/10/2015
dc.source.conferencelocationSan Jose, CA USA
imec.availabilityPublished - imec


Files in this item

FilesSizeFormatView

There are no files associated with this item.

This item appears in the following collection(s)

Show simple item record