dc.contributor.author | Ong, Patrick | |
dc.contributor.author | Teugels, Lieve | |
dc.contributor.author | Ansar, Sheikh | |
dc.contributor.author | Delande, Tinne | |
dc.contributor.author | Bhonsle, Rithu | |
dc.contributor.author | Siebert, Max | |
dc.contributor.author | Leunissen, Leonardus | |
dc.date.accessioned | 2021-10-22T21:29:05Z | |
dc.date.available | 2021-10-22T21:29:05Z | |
dc.date.issued | 2015 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/25707 | |
dc.source | IIOimport | |
dc.title | Updates on Ge AND SiGe CMP processes for integration as high mobility channel materials | |
dc.type | Meeting abstract | |
dc.contributor.imecauthor | Ong, Patrick | |
dc.contributor.imecauthor | Teugels, Lieve | |
dc.contributor.imecauthor | Delande, Tinne | |
dc.contributor.orcidimec | Ong, Patrick::0000-0002-2072-292X | |
dc.contributor.orcidimec | Teugels, Lieve::0000-0002-6613-9414 | |
dc.source.peerreview | yes | |
dc.source.conference | International Conference on Planarization/CMP Technology - ICPT | |
dc.source.conferencedate | 30/09/2015 | |
dc.source.conferencelocation | Chandler USA | |
imec.availability | Published - imec | |