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dc.contributor.authorOng, Patrick
dc.contributor.authorTeugels, Lieve
dc.contributor.authorAnsar, Sheikh
dc.contributor.authorDelande, Tinne
dc.contributor.authorBhonsle, Rithu
dc.contributor.authorSiebert, Max
dc.contributor.authorLeunissen, Leonardus
dc.date.accessioned2021-10-22T21:29:05Z
dc.date.available2021-10-22T21:29:05Z
dc.date.issued2015
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/25707
dc.sourceIIOimport
dc.titleUpdates on Ge AND SiGe CMP processes for integration as high mobility channel materials
dc.typeMeeting abstract
dc.contributor.imecauthorOng, Patrick
dc.contributor.imecauthorTeugels, Lieve
dc.contributor.imecauthorDelande, Tinne
dc.contributor.orcidimecOng, Patrick::0000-0002-2072-292X
dc.contributor.orcidimecTeugels, Lieve::0000-0002-6613-9414
dc.source.peerreviewyes
dc.source.conferenceInternational Conference on Planarization/CMP Technology - ICPT
dc.source.conferencedate30/09/2015
dc.source.conferencelocationChandler USA
imec.availabilityPublished - imec


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