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Thermal experimental and modeling analysis of high power 3D packages
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Authors
Oprins, Herman
;
Cherman, Vladimir
;
Van der Plas, Geert
;
Maggioni, Federica
;
De Vos, Joeri
;
Beyne, Eric
Conference
International Conference on IC Design and Technology - ICICDT
Title
Thermal experimental and modeling analysis of high power 3D packages
Publication type
Proceedings paper
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