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Thermal experimental and modeling analysis of high power 3D packages

dc.contributor.authorOprins, Herman
dc.contributor.authorCherman, Vladimir
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorMaggioni, Federica
dc.contributor.authorDe Vos, Joeri
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-22T21:30:36Z
dc.date.available2021-10-22T21:30:36Z
dc.date.issued2015-06
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/25711
dc.sourceIIOimport
dc.titleThermal experimental and modeling analysis of high power 3D packages
dc.typeProceedings paper
dc.contributor.imecauthorOprins, Herman
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorDe Vos, Joeri
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecOprins, Herman::0000-0003-0680-4969
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecDe Vos, Joeri::0000-0002-9332-9336
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.beginpage1
dc.source.endpage4
dc.source.conferenceInternational Conference on IC Design and Technology - ICICDT
dc.source.conferencedate1/06/2015
dc.source.conferencelocationLeuven Belgium
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7165906
imec.availabilityPublished - imec


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