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Enabling pre-sssembly process of 3D wafers with high topography at the backside

dc.contributor.authorPodpod, Arnita
dc.contributor.authorDemeurisse, Caroline
dc.contributor.authorInoue, Fumihiro
dc.contributor.authorDuval, Fabrice
dc.contributor.authorVisker, Jakob
dc.contributor.authorDe Vos, Joeri
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-22T21:52:33Z
dc.date.available2021-10-22T21:52:33Z
dc.date.issued2015
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/25766
dc.sourceIIOimport
dc.titleEnabling pre-sssembly process of 3D wafers with high topography at the backside
dc.typeProceedings paper
dc.contributor.imecauthorPodpod, Arnita
dc.contributor.imecauthorDemeurisse, Caroline
dc.contributor.imecauthorInoue, Fumihiro
dc.contributor.imecauthorDuval, Fabrice
dc.contributor.imecauthorVisker, Jakob
dc.contributor.imecauthorDe Vos, Joeri
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecDe Vos, Joeri::0000-0002-9332-9336
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.conference17th Electronics Packaging Technology Conference - EPTC
dc.source.conferencedate2/12/2015
dc.source.conferencelocationSingapore Singapore
imec.availabilityPublished - imec


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