Show simple item record

Modeling the effect of charges in the back side passivation layer on through silicon via (TSV) capacitance after wafer thinning

dc.contributor.authorRack, Martin
dc.contributor.authorStucchi, Michele
dc.contributor.authorSun, Xiao
dc.contributor.authorRoda Neve, Cesar
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorBeyne, Eric
dc.contributor.authorAbsil, Philippe
dc.contributor.authorRaskin, J-P
dc.date.accessioned2021-10-22T22:01:11Z
dc.date.available2021-10-22T22:01:11Z
dc.date.issued2015
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/25787
dc.sourceIIOimport
dc.titleModeling the effect of charges in the back side passivation layer on through silicon via (TSV) capacitance after wafer thinning
dc.typeProceedings paper
dc.contributor.imecauthorStucchi, Michele
dc.contributor.imecauthorSun, Xiao
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorAbsil, Philippe
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.beginpage1
dc.source.endpage4
dc.source.conferenceIEEE MTT-S International Microwave Symposium - IMS
dc.source.conferencedate17/05/2015
dc.source.conferencelocationPhoenix, AZ USA
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7167022
imec.availabilityPublished - imec


Files in this item

FilesSizeFormatView

There are no files associated with this item.

This item appears in the following collection(s)

Show simple item record