Authors

Rack, Martin; Stucchi, Michele; Sun, Xiao; Roda Neve, Cesar; Van der Plas, Geert; Beyne, Eric; Absil, Philippe; Raskin, J-P

Conference

IEEE MTT-S International Microwave Symposium - IMS

Title

Modeling the effect of charges in the back side passivation layer on through silicon via (TSV) capacitance after wafer thinning

Publication type

Proceedings paper