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Modeling the effect of charges in the back side passivation layer on through silicon via (TSV) capacitance after wafer thinning
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1957 since deposited on 2021-10-22
1last month
Acq. date: 2025-12-12
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Metrics
Views
1957 since deposited on 2021-10-22
1last month
Acq. date: 2025-12-12
Citations