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Modeling the effect of charges in the back side passivation layer on through silicon via (TSV) capacitance after wafer thinning
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1954 since deposited on 2021-10-22
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Acq. date: 2025-10-24
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Views
1954 since deposited on 2021-10-22
428item.page.metrics.field.last-week
Acq. date: 2025-10-24
Citations