Publication:
Modeling the effect of charges in the back side passivation layer on through silicon via (TSV) capacitance after wafer thinning
Date
Loading...
Journal
Abstract
Description
Statistics
Views
1957 since deposited on 2021-10-22
Acq. date: 2026-01-25
Citations
Statistics
Views
1957 since deposited on 2021-10-22
Acq. date: 2026-01-25
Citations