Publication:
Modeling the effect of charges in the back side passivation layer on through silicon via (TSV) capacitance after wafer thinning
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1961 since deposited on 2021-10-22
3last month
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Acq. date: 2026-08-09
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Statistics
Views
1961 since deposited on 2021-10-22
3last month
1last week
Acq. date: 2026-08-09
Citations