Skip to content
Institutional repository
Communities & Collections
Browse
Site
Log In
Modeling the effect of charges in the back side passivation layer on through silicon via (TSV) capacitance after wafer thinning
Statistics
Statistics by Category
Download view's map
PNG
JPEG/JPG
Reports
Most viewed
Most viewed per month
Top city views
File Visits
Export Excel
Export CSV
Item
Views
Modeling the effect of charges in the back side passivation layer on through silicon via (TSV) capacitance after wafer thinning
1360