At-speed delay testing of inter-die connections of 2.5D- and 3D-SICs
dc.contributor.author | Shibin, Konstantin | |
dc.contributor.author | Chickermane, Vivek | |
dc.contributor.author | Keller, Brion | |
dc.contributor.author | Papameletis, Christos | |
dc.contributor.author | Marinissen, Erik Jan | |
dc.date.accessioned | 2021-10-22T22:48:31Z | |
dc.date.available | 2021-10-22T22:48:31Z | |
dc.date.issued | 2015-05 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/25897 | |
dc.source | IIOimport | |
dc.title | At-speed delay testing of inter-die connections of 2.5D- and 3D-SICs | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Marinissen, Erik Jan | |
dc.contributor.orcidimec | Marinissen, Erik Jan::0000-0002-5058-8303 | |
dc.source.peerreview | yes | |
dc.source.conference | IEEE European Test Symposium - ETS | |
dc.source.conferencedate | 25/05/2015 | |
dc.source.conferencelocation | Cluj-Napoca Romania | |
imec.availability | Published - imec |
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