Authors

Shibin, Konstantin; Chickermane, Vivek; Keller, Brion; Papameletis, Christos; Marinissen, Erik Jan

Conference

IEEE International Workshop on Testing Three-Dimensional Stacked Integrated Circuits (3D-TEST)

Title

At-speed inter-die interconnect test in 2.5D- and 3D-SICs

Publication type

Proceedings paper