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Post-bond interconnect test and diagnosis for 3D memory stacked on logic
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Authors
Taouil, Mottaqiallah
;
Masadeh, Mahmoud
;
Hamdioui, Said
;
Marinissen, Erik Jan
ISSN
0278-0070
Issue
11
Journal
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD)
Volume
34
Title
Post-bond interconnect test and diagnosis for 3D memory stacked on logic
Publication type
Journal article
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