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Modelling step height reduction and local removal rates based on pad-substrate interactions

dc.contributor.authorGrillaert, Joost
dc.contributor.authorMeuris, Marc
dc.contributor.authorHeylen, Nancy
dc.contributor.authorDevriendt, Katia
dc.contributor.authorVrancken, Evi
dc.contributor.authorHeyns, Marc
dc.date.accessioned2021-09-30T12:03:17Z
dc.date.available2021-09-30T12:03:17Z
dc.date.issued1998
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/2598
dc.sourceIIOimport
dc.titleModelling step height reduction and local removal rates based on pad-substrate interactions
dc.typeProceedings paper
dc.contributor.imecauthorMeuris, Marc
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorDevriendt, Katia
dc.contributor.imecauthorVrancken, Evi
dc.contributor.imecauthorHeyns, Marc
dc.contributor.orcidimecMeuris, Marc::0000-0002-9580-6810
dc.contributor.orcidimecDevriendt, Katia::0000-0002-0662-7926
dc.source.peerreviewno
dc.source.beginpage79
dc.source.endpage86
dc.source.conferenceProceedings of the 3rd International Chemical-Mechanical-Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC);
dc.source.conferencelocation
imec.availabilityPublished - imec


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