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Cobalt bottom-up contact and via prefill enabling advanced logic and DRAM technologies

dc.contributor.authorvan der Veen, Marleen
dc.contributor.authorVandersmissen, Kevin
dc.contributor.authorDictus, Dries
dc.contributor.authorDemuynck, Steven
dc.contributor.authorLiu, Ran
dc.contributor.authorBin, Xiaomin
dc.contributor.authorNalla, Praveen
dc.contributor.authorLesniewska, Alicja
dc.contributor.authorHall, Laurie
dc.contributor.authorCroes, Kristof
dc.contributor.authorZhao, Larry
dc.contributor.authorBoemmels, Juergen
dc.contributor.authorKolics, Artur
dc.contributor.authorTokei, Zsolt
dc.date.accessioned2021-10-23T00:00:23Z
dc.date.available2021-10-23T00:00:23Z
dc.date.issued2015
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26051
dc.sourceIIOimport
dc.titleCobalt bottom-up contact and via prefill enabling advanced logic and DRAM technologies
dc.typeProceedings paper
dc.contributor.imecauthorvan der Veen, Marleen
dc.contributor.imecauthorVandersmissen, Kevin
dc.contributor.imecauthorDictus, Dries
dc.contributor.imecauthorDemuynck, Steven
dc.contributor.imecauthorLesniewska, Alicja
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorBoemmels, Juergen
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecvan der Veen, Marleen::0000-0002-9402-8922
dc.contributor.orcidimecDictus, Dries::0000-0002-7896-1747
dc.contributor.orcidimecLesniewska, Alicja::0000-0003-3863-065X
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage25
dc.source.endpage28
dc.source.conferenceIEEE International Interconnect Technology Conference - IITC / Materials for Advanced Metallization Conference - MAM
dc.source.conferencedate18/05/2015
dc.source.conferencelocationGrenoble France
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7325605
imec.availabilityPublished - open access


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