Show simple item record

Impact of solder-joint tilting on the reliability of LED-based PCB assemblies: A combined experimental and FEM analysis

dc.contributor.authorVandevelde, Bart
dc.contributor.authorZanon, Franco
dc.contributor.authorGriffoni, Alessio
dc.contributor.authorLi, Xiaoling
dc.contributor.authorWillems, Geert
dc.contributor.authorMeneghini, Matteo
dc.date.accessioned2021-10-23T00:23:13Z
dc.date.available2021-10-23T00:23:13Z
dc.date.issued2015
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26101
dc.sourceIIOimport
dc.titleImpact of solder-joint tilting on the reliability of LED-based PCB assemblies: A combined experimental and FEM analysis
dc.typeProceedings paper
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorWillems, Geert
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecWillems, Geert::0000-0002-9137-618X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage1
dc.source.endpage4
dc.source.conference16th Int. Conf. Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - EuroSimE
dc.source.conferencedate20/04/2015
dc.source.conferencelocationBudapest Hungary
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7103170
imec.availabilityPublished - open access


Files in this item

Thumbnail
Name:
31847.pdf
Size:
1.987Mb
Format:
PDF
View/open

This item appears in the following collection(s)

Show simple item record