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Challenges and solutions for chip package interaction

dc.contributor.authorVanstreels, Kris
dc.contributor.authorCherman, Vladimir
dc.contributor.authorZahedmanesh, Houman
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorGonzalez, Mario
dc.date.accessioned2021-10-23T00:28:41Z
dc.date.available2021-10-23T00:28:41Z
dc.date.issued2015
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26112
dc.sourceIIOimport
dc.titleChallenges and solutions for chip package interaction
dc.typeProceedings paper
dc.contributor.imecauthorVanstreels, Kris
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorZahedmanesh, Houman
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.orcidimecVanstreels, Kris::0000-0002-4420-0966
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.source.peerreviewyes
dc.source.beginpage101
dc.source.endpage103
dc.source.conferenceFrontiers of Characterization and Metrology for Nanoelectronics - FCMN
dc.source.conferencedate14/04/2015
dc.source.conferencelocationDresden Germany
dc.identifier.urlhttps://www.nist.gov/sites/default/files/documents/pml/div683/conference/FCMN_CD.pdf
imec.availabilityPublished - imec


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