Fine pitch 3D-TSV based high frequency components for RF MEMS applications

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Authors
Vitale, Wolfgang; Fernández-Bolaños, Montserrat; Merkel, Reinhart; Enayati, Amin; Ocket, Ilja; De Raedt, Walter; Weber, Josef; Ramm, Peter; Ionescu, Adrian M.
Conference
IEEE 65th Electronic Components and Technology Conference - ECTC
Title
Fine pitch 3D-TSV based high frequency components for RF MEMS applications
Publication type
Proceedings paper
Embargo date
9999-12-31
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