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Fine pitch 3D-TSV based high frequency components for RF MEMS applications

dc.contributor.authorVitale, Wolfgang
dc.contributor.authorFernández-Bolaños, Montserrat
dc.contributor.authorMerkel, Reinhart
dc.contributor.authorEnayati, Amin
dc.contributor.authorOcket, Ilja
dc.contributor.authorDe Raedt, Walter
dc.contributor.authorWeber, Josef
dc.contributor.authorRamm, Peter
dc.contributor.authorIonescu, Adrian M.
dc.date.accessioned2021-10-23T00:45:14Z
dc.date.available2021-10-23T00:45:14Z
dc.date.issued2015
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26146
dc.sourceIIOimport
dc.titleFine pitch 3D-TSV based high frequency components for RF MEMS applications
dc.typeProceedings paper
dc.contributor.imecauthorOcket, Ilja
dc.contributor.imecauthorDe Raedt, Walter
dc.contributor.orcidimecDe Raedt, Walter::0000-0002-7117-7976
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage585
dc.source.endpage590
dc.source.conferenceIEEE 65th Electronic Components and Technology Conference - ECTC
dc.source.conferencedate31/05/2015
dc.source.conferencelocationSan Diego, CA USA
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7159650
imec.availabilityPublished - open access


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