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Thermal compression bonding of 20 μm pitch micro bumps with pre-applied underfill – process and reliability

dc.contributor.authorWang, Teng
dc.contributor.authorDe Messemaeker, Joke
dc.contributor.authorCherman, Vladimir
dc.contributor.authorKay, Alvin Chow Chee
dc.contributor.authorCadacio Jr., Francisco
dc.contributor.authorMatterne, Mireille
dc.contributor.authorSimons, Veerle
dc.contributor.authorVan De Peer, Myriam
dc.contributor.authorLesniewska, Alicja
dc.contributor.authorVarela Pedreira, Olalla
dc.contributor.authorGerets, Carine
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-23T00:52:26Z
dc.date.available2021-10-23T00:52:26Z
dc.date.issued2015
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26160
dc.sourceIIOimport
dc.titleThermal compression bonding of 20 μm pitch micro bumps with pre-applied underfill – process and reliability
dc.typeProceedings paper
dc.contributor.imecauthorDe Messemaeker, Joke
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorSimons, Veerle
dc.contributor.imecauthorVan De Peer, Myriam
dc.contributor.imecauthorLesniewska, Alicja
dc.contributor.imecauthorVarela Pedreira, Olalla
dc.contributor.imecauthorGerets, Carine
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecSimons, Veerle::0000-0001-5714-955X
dc.contributor.orcidimecLesniewska, Alicja::0000-0003-3863-065X
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecDe Messemaeker, Joke::0000-0002-4872-0176
dc.contributor.orcidimecCherman, Vladimir::0000-0002-8068-9236
dc.contributor.orcidimecVarela Pedreira, Olalla::0000-0002-2987-1972
dc.source.peerreviewyes
dc.source.conferenceElectronic Packaging Technology Conference - EPTC
dc.source.conferencedate2/12/2015
dc.source.conferencelocationSingapore Singapore
imec.availabilityPublished - imec


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