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Defectivity evaluation of EUV reticles with etched multilayer image border by wafer printing analysis

dc.contributor.authorWatanabe, Genta
dc.contributor.authorJonckheere, Rik
dc.contributor.authorVerduijn, Erik
dc.contributor.authorFukugami, Norihito
dc.contributor.authorSakata, Yo
dc.contributor.authorKodera, Yutaka
dc.contributor.authorGallagher, Emily
dc.date.accessioned2021-10-23T00:55:27Z
dc.date.available2021-10-23T00:55:27Z
dc.date.issued2015
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26166
dc.sourceIIOimport
dc.titleDefectivity evaluation of EUV reticles with etched multilayer image border by wafer printing analysis
dc.typeOral presentation
dc.contributor.imecauthorJonckheere, Rik
dc.contributor.imecauthorVerduijn, Erik
dc.contributor.imecauthorGallagher, Emily
dc.contributor.orcidimecJonckheere, Rik::0000-0003-2211-9443
dc.contributor.orcidimecGallagher, Emily::0000-0002-2927-8298
dc.source.peerreviewno
dc.source.conferenceWorkshop NGL 2015 - The Japan Society of Applied Physics
dc.source.conferencedate6/07/2015
dc.source.conferencelocationTokyo Japan
imec.availabilityPublished - imec


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