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A novel low temperature etch approach to reduce ULK plasma damage

dc.contributor.authorZhang, Liping
dc.contributor.authorde Marneffe, Jean-Francois
dc.contributor.authorLeroy, F.
dc.contributor.authorLjazouli, R.
dc.contributor.authorLefaucheux, P.
dc.contributor.authorTillocher, T
dc.contributor.authorDussart, R.
dc.contributor.authorMaekawa, K.
dc.contributor.authorYatsuda, K.
dc.contributor.authorDussarrat, C.
dc.contributor.authorDe Gendt, Stefan
dc.contributor.authorBaklanov, Mikhaïl
dc.date.accessioned2021-10-23T01:34:38Z
dc.date.available2021-10-23T01:34:38Z
dc.date.issued2015
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26241
dc.sourceIIOimport
dc.titleA novel low temperature etch approach to reduce ULK plasma damage
dc.typeMeeting abstract
dc.contributor.imecauthorZhang, Liping
dc.contributor.imecauthorde Marneffe, Jean-Francois
dc.contributor.imecauthorDe Gendt, Stefan
dc.contributor.orcidimecDe Gendt, Stefan::0000-0003-3775-3578
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpagen/a
dc.source.conferencePlasma Etch and Strip in Microtechnology - PESM
dc.source.conferencedate27/04/2015
dc.source.conferencelocationLeuven Belgium
dc.identifier.urlhttp://pesm-conference.org/files/2015_abstractbook.pdf
imec.availabilityPublished - open access


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