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Atomic layer deposition of ruthenium for advanced interconnect applications

dc.contributor.authorAdelmann, Christoph
dc.contributor.authorPopovici, Mihaela Ioana
dc.contributor.authorGroven, Benjamin
dc.contributor.authorWen, Liang Gong
dc.contributor.authorDutta, Shibesh
dc.contributor.authorBoemmels, Juergen
dc.contributor.authorTokei, Zsolt
dc.contributor.authorVan Elshocht, Sven
dc.date.accessioned2021-10-23T10:04:13Z
dc.date.available2021-10-23T10:04:13Z
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26267
dc.sourceIIOimport
dc.titleAtomic layer deposition of ruthenium for advanced interconnect applications
dc.typeMeeting abstract
dc.contributor.imecauthorAdelmann, Christoph
dc.contributor.imecauthorPopovici, Mihaela Ioana
dc.contributor.imecauthorGroven, Benjamin
dc.contributor.imecauthorBoemmels, Juergen
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorVan Elshocht, Sven
dc.contributor.orcidimecAdelmann, Christoph::0000-0002-4831-3159
dc.contributor.orcidimecGroven, Benjamin::0000-0002-5781-7594
dc.contributor.orcidimecVan Elshocht, Sven::0000-0002-6512-1909
dc.source.peerreviewyes
dc.source.beginpagePMT-08
dc.source.conferenceMaterials for Advanced Metalization Conference - MAM
dc.source.conferencedate20/03/2016
dc.source.conferencelocationBrussels Belgium
imec.availabilityPublished - imec


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