Publication:

Nondestructive monitoring of die warpage in encapsulated chip packages

Date

2016

Journal article

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Files

33787.pdf 2.36 MB

Author(s)

;

Vijayaraghavan, Rajani K

;

;

Cherman, Vladimir

;

Varela Pedreira, Olalla

;

Tanner, Brian K.

;

Danilewsky, Andreas N.

;

De Wolf, Ingrid

;

McNally, Patrick J.

Journal

IEEE Transactions on Components, Packaging and Manufacturing Technology

Metrics

1833 since deposited on 2021-10-23

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Acq. date: 2026-01-09