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dc.contributor.authorClark, William
dc.contributor.authorJuncker, Aurelie
dc.contributor.authorPaladugu, E.
dc.contributor.authorFried, David
dc.contributor.authorWilson, Chris
dc.contributor.authorPourtois, Geoffrey
dc.contributor.authorGallagher, Emily
dc.contributor.authorde Jamblinne de Meux, Albert
dc.contributor.authorPiumi, Daniele
dc.contributor.authorBoemmels, Juergen
dc.contributor.authorTokei, Zsolt
dc.contributor.authorMocuta, Dan
dc.date.accessioned2021-10-23T10:20:26Z
dc.date.available2021-10-23T10:20:26Z
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26462
dc.sourceIIOimport
dc.titleA million wafer, virtual fabrication approach to determine process capability requirements for an industry-standard 5nm BEOL two-level metal flow
dc.typeProceedings paper
dc.contributor.imecauthorWilson, Chris
dc.contributor.imecauthorPourtois, Geoffrey
dc.contributor.imecauthorGallagher, Emily
dc.contributor.imecauthorPiumi, Daniele
dc.contributor.imecauthorBoemmels, Juergen
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecPourtois, Geoffrey::0000-0003-2597-8534
dc.contributor.orcidimecGallagher, Emily::0000-0002-2927-8298
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage43
dc.source.endpage46
dc.source.conferenceInternational Conference on Simulation of Semiconductor Processes and Devices - SISPAD
dc.source.conferencedate6/09/2016
dc.source.conferencelocationNuremberg Germany
dc.identifier.urlhttp://ieeexplore.ieee.org/document/7605144/
imec.availabilityPublished - open access


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