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Paths towards low-damage etching of highly porous organo-silicate low-k dielectrics

dc.contributor.authorde Marneffe, Jean-Francois
dc.contributor.authorZhang, Liping
dc.contributor.authorWatanabe, Mitsuhiro
dc.contributor.authoryatsuda, koichi
dc.contributor.authorMaekawa, Kaoru
dc.contributor.authorCooke, Mike
dc.contributor.authorGoodyear, Andy
dc.contributor.authorLeroy, Floriane
dc.contributor.authorTillocher, Thomas
dc.contributor.authorLefaucheux, Philippe
dc.contributor.authorDussart, Remi
dc.contributor.authorDussarat, Christian
dc.contributor.authorBaklanov, Mikhaïl
dc.date.accessioned2021-10-23T10:26:20Z
dc.date.available2021-10-23T10:26:20Z
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26500
dc.sourceIIOimport
dc.titlePaths towards low-damage etching of highly porous organo-silicate low-k dielectrics
dc.typeOral presentation
dc.contributor.imecauthorde Marneffe, Jean-Francois
dc.contributor.imecauthorZhang, Liping
dc.source.peerreviewno
dc.source.conferenceSPIE Advanced Lithography Conference
dc.source.conferencedate21/02/2016
dc.source.conferencelocationSan Jose, CA USA
imec.availabilityPublished - imec
imec.internalnotes(Invited Paper) Paper 9782-5


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