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Importance of alignment control during permanent bonding and its impact on via- last alignment for high density 3D interconnects

dc.contributor.authorDe Vos, Joeri
dc.contributor.authorPeng, Lan
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorVan Ongeval, Joost
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyne, Eric
dc.contributor.authorKurz, Florian
dc.contributor.authorWagenleiter, Thomas
dc.contributor.authorWimplinger, Markus
dc.contributor.authorUhrmann, Thomas
dc.date.accessioned2021-10-23T10:29:30Z
dc.date.available2021-10-23T10:29:30Z
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26519
dc.sourceIIOimport
dc.titleImportance of alignment control during permanent bonding and its impact on via- last alignment for high density 3D interconnects
dc.typeProceedings paper
dc.contributor.imecauthorDe Vos, Joeri
dc.contributor.imecauthorPeng, Lan
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorVan Ongeval, Joost
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecDe Vos, Joeri::0000-0002-9332-9336
dc.contributor.orcidimecPeng, Lan::0000-0003-1824-126X
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.beginpage1
dc.source.endpage4
dc.source.conferenceIEEE International Conference on 3D System Integration - 3DIC
dc.source.conferencedate8/11/2016
dc.source.conferencelocationSan Francisco, CA USA
dc.identifier.urlhttp://ieeexplore.ieee.org/document/7970002/
imec.availabilityPublished - imec


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