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Die to wafer 3D stacking for below 10μm pitch microbumps

dc.contributor.authorDerakhshandeh, Jaber
dc.contributor.authorHou, Lin
dc.contributor.authorDe Preter, Inge
dc.contributor.authorGerets, Carine
dc.contributor.authorSuhard, Samuel
dc.contributor.authorDubey, Vikas
dc.contributor.authorJamieson, Geraldine
dc.contributor.authorInoue, Fumihiro
dc.contributor.authorWebers, Tomas
dc.contributor.authorBex, Pieter
dc.contributor.authorCapuz, Giovanni
dc.contributor.authorBeyne, Eric
dc.contributor.authorSlabbekoorn, John
dc.contributor.authorWang, Teng
dc.contributor.authorJourdain, Anne
dc.contributor.authorBeyer, Gerald
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorMiller, Andy
dc.date.accessioned2021-10-23T10:33:05Z
dc.date.available2021-10-23T10:33:05Z
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26538
dc.sourceIIOimport
dc.titleDie to wafer 3D stacking for below 10μm pitch microbumps
dc.typeProceedings paper
dc.contributor.imecauthorDerakhshandeh, Jaber
dc.contributor.imecauthorHou, Lin
dc.contributor.imecauthorDe Preter, Inge
dc.contributor.imecauthorGerets, Carine
dc.contributor.imecauthorSuhard, Samuel
dc.contributor.imecauthorJamieson, Geraldine
dc.contributor.imecauthorInoue, Fumihiro
dc.contributor.imecauthorWebers, Tomas
dc.contributor.imecauthorBex, Pieter
dc.contributor.imecauthorCapuz, Giovanni
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorSlabbekoorn, John
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorMiller, Andy
dc.contributor.orcidimecDerakhshandeh, Jaber::0000-0003-2448-9165
dc.contributor.orcidimecJamieson, Geraldine::0000-0002-6750-097X
dc.contributor.orcidimecBex, Pieter::0000-0003-0896-2514
dc.contributor.orcidimecCapuz, Giovanni::0000-0002-5263-4836
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecJourdain, Anne::0000-0002-7610-0513
dc.contributor.orcidimecMiller, Andy::0000-0001-7048-2242
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage1
dc.source.endpage4
dc.source.conferenceIEEE International Conference on 3D System Integration - 3DIC
dc.source.conferencedate9/11/2016
dc.source.conferencelocationSan Francisco, CA USA
dc.identifier.urlhttp://ieeexplore.ieee.org/document/7969993/
imec.availabilityPublished - imec


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