Surface treatment to enable low temperature and pressure copper direct bonding

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Authors
Dubey, Vikas; Derakhshandeh, Jaber; Beyne, Eric; Gerets, Carine; Cooper, E.; Laermans, Patrick; De Leersnijder, Koen; Baumans, Kim; Rebibis, Kenneth June; Miller, Andy; De Wolf, Ingrid
Conference
IEEE 66th Electronic Components and Technology Conference - ECTC
Title
Surface treatment to enable low temperature and pressure copper direct bonding
Publication type
Proceedings paper
Embargo date
9999-12-31
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