dc.contributor.author | Flack, Warren | |
dc.contributor.author | Hsieh, Robert | |
dc.contributor.author | Kenyon, Gareth | |
dc.contributor.author | Slabbekoorn, John | |
dc.contributor.author | Czarnecki, Piotr | |
dc.contributor.author | Tobback, Bert | |
dc.contributor.author | Van Huylenbroeck, Stefaan | |
dc.contributor.author | Stucchi, Michele | |
dc.contributor.author | Vandeweyer, Tom | |
dc.contributor.author | Miller, Andy | |
dc.date.accessioned | 2021-10-23T10:50:33Z | |
dc.date.available | 2021-10-23T10:50:33Z | |
dc.date.issued | 2016 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/26623 | |
dc.source | IIOimport | |
dc.title | Overlay performance of through Si via last lithography for 3d packaging | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Slabbekoorn, John | |
dc.contributor.imecauthor | Czarnecki, Piotr | |
dc.contributor.imecauthor | Tobback, Bert | |
dc.contributor.imecauthor | Van Huylenbroeck, Stefaan | |
dc.contributor.imecauthor | Stucchi, Michele | |
dc.contributor.imecauthor | Vandeweyer, Tom | |
dc.contributor.imecauthor | Miller, Andy | |
dc.contributor.orcidimec | Van Huylenbroeck, Stefaan::0000-0001-9978-3575 | |
dc.date.embargo | 9999-12-31 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 564 | |
dc.source.endpage | 568 | |
dc.source.conference | IEEE 18th Electronics Packaging Technology Conference - EPTC | |
dc.source.conferencedate | 30/11/2016 | |
dc.source.conferencelocation | Singapore Singapore | |
dc.identifier.url | http://ieeexplore.ieee.org/document/7861543/ | |
imec.availability | Published - open access | |