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Overlay performance of through Si via last lithography for 3d packaging

dc.contributor.authorFlack, Warren
dc.contributor.authorHsieh, Robert
dc.contributor.authorKenyon, Gareth
dc.contributor.authorSlabbekoorn, John
dc.contributor.authorCzarnecki, Piotr
dc.contributor.authorTobback, Bert
dc.contributor.authorVan Huylenbroeck, Stefaan
dc.contributor.authorStucchi, Michele
dc.contributor.authorVandeweyer, Tom
dc.contributor.authorMiller, Andy
dc.date.accessioned2021-10-23T10:50:33Z
dc.date.available2021-10-23T10:50:33Z
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26623
dc.sourceIIOimport
dc.titleOverlay performance of through Si via last lithography for 3d packaging
dc.typeProceedings paper
dc.contributor.imecauthorSlabbekoorn, John
dc.contributor.imecauthorCzarnecki, Piotr
dc.contributor.imecauthorTobback, Bert
dc.contributor.imecauthorVan Huylenbroeck, Stefaan
dc.contributor.imecauthorStucchi, Michele
dc.contributor.imecauthorVandeweyer, Tom
dc.contributor.imecauthorMiller, Andy
dc.contributor.orcidimecVan Huylenbroeck, Stefaan::0000-0001-9978-3575
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage564
dc.source.endpage568
dc.source.conferenceIEEE 18th Electronics Packaging Technology Conference - EPTC
dc.source.conferencedate30/11/2016
dc.source.conferencelocationSingapore Singapore
dc.identifier.urlhttp://ieeexplore.ieee.org/document/7861543/
imec.availabilityPublished - open access


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