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Characterization of extreme Si thinning proces for wafer-to-wafer stacking

dc.contributor.authorInoue, Fumihiro
dc.contributor.authorJourdain, Anne
dc.contributor.authorDe Vos, Joeri
dc.contributor.authorPeng, Lan
dc.contributor.authorLiebens, Maarten
dc.contributor.authorArmini, Silvia
dc.contributor.authorUedono, Akira
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyne, Eric
dc.contributor.authorSleeckx, Erik
dc.date.accessioned2021-10-23T11:27:51Z
dc.date.available2021-10-23T11:27:51Z
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26765
dc.sourceIIOimport
dc.titleCharacterization of extreme Si thinning proces for wafer-to-wafer stacking
dc.typeProceedings paper
dc.contributor.imecauthorInoue, Fumihiro
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorDe Vos, Joeri
dc.contributor.imecauthorPeng, Lan
dc.contributor.imecauthorLiebens, Maarten
dc.contributor.imecauthorArmini, Silvia
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorSleeckx, Erik
dc.contributor.orcidimecDe Vos, Joeri::0000-0002-9332-9336
dc.contributor.orcidimecPeng, Lan::0000-0003-1824-126X
dc.contributor.orcidimecArmini, Silvia::0000-0003-0578-3422
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecSleeckx, Erik::0000-0003-2560-6132
dc.source.peerreviewyes
dc.source.beginpage2095
dc.source.endpage2102
dc.source.conferenceIEEE 66th Electronic Components and Technology Conference - ECTC
dc.source.conferencedate31/05/2016
dc.source.conferencelocationLas Vegas, NV USA
dc.identifier.urlhttp://ieeexplore.ieee.org/document/7545713/?arnumber=7545713
imec.availabilityPublished - imec


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