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Edge trimming for wafer-to-wafer 3D integration

dc.contributor.authorInoue, Fumihiro
dc.contributor.authorVisker, Jakob
dc.contributor.authorJourdain, Anne
dc.contributor.authorMoeller, Berthold
dc.contributor.authorYokoyama, Kaori
dc.contributor.authorPeng, Lan
dc.contributor.authorKosemura, Daisuke
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyne, Eric
dc.contributor.authorSleeckx, Erik
dc.date.accessioned2021-10-23T11:28:10Z
dc.date.available2021-10-23T11:28:10Z
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26766
dc.sourceIIOimport
dc.titleEdge trimming for wafer-to-wafer 3D integration
dc.typeProceedings paper
dc.contributor.imecauthorInoue, Fumihiro
dc.contributor.imecauthorVisker, Jakob
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorPeng, Lan
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorSleeckx, Erik
dc.contributor.orcidimecPeng, Lan::0000-0003-1824-126X
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecSleeckx, Erik::0000-0003-2560-6132
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpageP3D-03
dc.source.conferenceMaterials for Advanced Metallization Conference - MAM
dc.source.conferencedate20/03/2015
dc.source.conferencelocationBrussels Belgium
imec.availabilityPublished - open access


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