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Light-induced capacitance alteration for non-destructive fault isolation in TSV structures for 3-D integration

dc.contributor.authorJacobs, Kristof J.P.
dc.contributor.authorKhaled, Ahmad
dc.contributor.authorStucchi, Michele
dc.contributor.authorWang, Teng
dc.contributor.authorGonzalez, Mario
dc.contributor.authorCroes, Kristof
dc.contributor.authorDe Wolf, Ingrid
dc.date.accessioned2021-10-23T11:29:50Z
dc.date.available2021-10-23T11:29:50Z
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26772
dc.sourceIIOimport
dc.titleLight-induced capacitance alteration for non-destructive fault isolation in TSV structures for 3-D integration
dc.typeProceedings paper
dc.contributor.imecauthorJacobs, Kristof J.P.
dc.contributor.imecauthorKhaled, Ahmad
dc.contributor.imecauthorStucchi, Michele
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecJacobs, Kristof J.P.::0000-0002-1081-3633
dc.contributor.orcidimecKhaled, Ahmad::0000-0003-2892-3176
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.source.peerreviewyes
dc.source.conferenceInternational Symposium for Testing and Failure Analysis - ISTFA
dc.source.conferencedate6/11/2016
dc.source.conferencelocationForth Worth,TX USA
imec.availabilityPublished - imec


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