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Extreme wafer thinning optimization for via-last applications

dc.contributor.authorJourdain, Anne
dc.contributor.authorDe Vos, Joeri
dc.contributor.authorInoue, Fumihiro
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.contributor.authorWalsby, Edward
dc.contributor.authorPatel, Jash
dc.contributor.authorAnsell, Oliver
dc.contributor.authorHopkins, Janet
dc.contributor.authorAshraf, Huma
dc.contributor.authorThomas, Dave
dc.date.accessioned2021-10-23T11:35:20Z
dc.date.available2021-10-23T11:35:20Z
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26791
dc.sourceIIOimport
dc.titleExtreme wafer thinning optimization for via-last applications
dc.typeProceedings paper
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorDe Vos, Joeri
dc.contributor.imecauthorInoue, Fumihiro
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorWalsby, Edward
dc.contributor.orcidimecDe Vos, Joeri::0000-0002-9332-9336
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.beginpage1
dc.source.endpage4
dc.source.conferenceIEEE International Conference on 3D System Integration - 3DIC
dc.source.conferencedate8/11/2016
dc.source.conferencelocationSan Francisco, CA USA
dc.identifier.urlhttp://ieeexplore.ieee.org/document/7970028/
imec.availabilityPublished - imec


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