dc.contributor.author | Jourdan, Nicolas | |
dc.contributor.author | Cellier, Daniel | |
dc.contributor.author | Van Elshocht, Sven | |
dc.contributor.author | Boemmels, Juergen | |
dc.contributor.author | Tokei, Zsolt | |
dc.date.accessioned | 2021-10-23T11:35:37Z | |
dc.date.available | 2021-10-23T11:35:37Z | |
dc.date.issued | 2016 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/26792 | |
dc.source | IIOimport | |
dc.title | 300mm wafer level CVD-Mn/iodine-CVD-Cu-based metallization study for advanced copper interconnections | |
dc.type | Meeting abstract | |
dc.contributor.imecauthor | Jourdan, Nicolas | |
dc.contributor.imecauthor | Cellier, Daniel | |
dc.contributor.imecauthor | Van Elshocht, Sven | |
dc.contributor.imecauthor | Boemmels, Juergen | |
dc.contributor.imecauthor | Tokei, Zsolt | |
dc.contributor.orcidimec | Van Elshocht, Sven::0000-0002-6512-1909 | |
dc.source.peerreview | no | |
dc.source.conference | Materials for Advanced Metallization Conference - MAM | |
dc.source.conferencedate | 20/03/2016 | |
dc.source.conferencelocation | Brussels Belgium | |
imec.availability | Published - imec | |