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dc.contributor.authorJourdan, Nicolas
dc.contributor.authorvan der Veen, Marleen
dc.contributor.authorVega Gonzalez, Victor
dc.contributor.authorCroes, Kristof
dc.contributor.authorLesniewska, Alicja
dc.contributor.authorVarela Pedreira, Olalla
dc.contributor.authorVan Elshocht, Sven
dc.contributor.authorBoemmels, Juergen
dc.contributor.authorTokei, Zsolt
dc.date.accessioned2021-10-23T11:35:56Z
dc.date.available2021-10-23T11:35:56Z
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26793
dc.sourceIIOimport
dc.titleCVD-Mn/CVD-Ru-based barrier/liner solution for advanced BEOL Cu/low-k interconnects
dc.typeProceedings paper
dc.contributor.imecauthorJourdan, Nicolas
dc.contributor.imecauthorvan der Veen, Marleen
dc.contributor.imecauthorVega Gonzalez, Victor
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorLesniewska, Alicja
dc.contributor.imecauthorVarela Pedreira, Olalla
dc.contributor.imecauthorVan Elshocht, Sven
dc.contributor.imecauthorBoemmels, Juergen
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecvan der Veen, Marleen::0000-0002-9402-8922
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecLesniewska, Alicja::0000-0003-3863-065X
dc.contributor.orcidimecVan Elshocht, Sven::0000-0002-6512-1909
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage37
dc.source.endpage39
dc.source.conferenceIEEE International Interconnect Technology Conference / Advanced Metallization Conference - IITC/AMC
dc.source.conferencedate23/05/2016
dc.source.conferencelocationSan Jose, CA USa
dc.identifier.urlhttp://ieeexplore.ieee.org/document/7507652/
imec.availabilityPublished - open access


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