dc.contributor.author | Kim, Soon-Wook | |
dc.contributor.author | Detalle, Mikael | |
dc.contributor.author | Peng, Lan | |
dc.contributor.author | Nolmans, Philip | |
dc.contributor.author | Heylen, Nancy | |
dc.contributor.author | Velenis, Dimitrios | |
dc.contributor.author | Miller, Andy | |
dc.contributor.author | Beyer, Gerald | |
dc.contributor.author | Beyne, Eric | |
dc.date.accessioned | 2021-10-23T11:48:00Z | |
dc.date.available | 2021-10-23T11:48:00Z | |
dc.date.issued | 2016 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/26831 | |
dc.source | IIOimport | |
dc.title | Ultra-fine pitch 3D integration using face-to-face hybrid wafer bonding combined with a via-middle through-silicon-via process | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Kim, Soon-Wook | |
dc.contributor.imecauthor | Detalle, Mikael | |
dc.contributor.imecauthor | Peng, Lan | |
dc.contributor.imecauthor | Nolmans, Philip | |
dc.contributor.imecauthor | Heylen, Nancy | |
dc.contributor.imecauthor | Velenis, Dimitrios | |
dc.contributor.imecauthor | Miller, Andy | |
dc.contributor.imecauthor | Beyer, Gerald | |
dc.contributor.imecauthor | Beyne, Eric | |
dc.contributor.orcidimec | Peng, Lan::0000-0003-1824-126X | |
dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
dc.date.embargo | 9999-12-31 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 1179 | |
dc.source.endpage | 1185 | |
dc.source.conference | IEEE 66th Electronic Components and Technology Conference - ECTC | |
dc.source.conferencedate | 31/05/2016 | |
dc.source.conferencelocation | Las Vegas, NV USA | |
dc.identifier.url | http://ieeexplore.ieee.org/document/7545574/?arnumber=7545574 | |
imec.availability | Published - open access | |