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Transient thermometry and HRTEM analysis of RRAM thermal dynamics during switching and failure

dc.contributor.authorKwon, J.
dc.contributor.authorSharma, A.A.
dc.contributor.authorChen, C.
dc.contributor.authorFantini, Andrea
dc.contributor.authorJurczak, Gosia
dc.contributor.authorBain, J.
dc.contributor.authorPicard, Y.
dc.contributor.authorSkowronski, Marek
dc.date.accessioned2021-10-23T11:59:38Z
dc.date.available2021-10-23T11:59:38Z
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26866
dc.sourceIIOimport
dc.titleTransient thermometry and HRTEM analysis of RRAM thermal dynamics during switching and failure
dc.typeProceedings paper
dc.contributor.imecauthorFantini, Andrea
dc.contributor.imecauthorJurczak, Gosia
dc.source.peerreviewyes
dc.source.conference2016 IEEE International Reliability Physics Symposium (IRPS)
dc.source.conferencedate2/04/2016
dc.source.conferencelocationPasadena, CA USA
dc.identifier.urlhttps://ieeexplore.ieee.org/document/7574579
imec.availabilityPublished - imec


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