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Identification of key factors to reduce stress induced during 3D IC's assembly

dc.contributor.authorLofrano, Melina
dc.contributor.authorGonzalez, Mario
dc.contributor.authorCherman, Vladimir
dc.date.accessioned2021-10-23T12:18:42Z
dc.date.available2021-10-23T12:18:42Z
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26924
dc.sourceIIOimport
dc.titleIdentification of key factors to reduce stress induced during 3D IC's assembly
dc.typeProceedings paper
dc.contributor.imecauthorLofrano, Melina
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.orcidimecGonzalez, Mario::0000-0003-4374-4854
dc.contributor.orcidimecCherman, Vladimir::0000-0002-8068-9236
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpagep58
dc.source.conference6th Electronics System-Integration Technology Conference - ESTC
dc.source.conferencedate13/09/2016
dc.source.conferencelocationGrenoble France
dc.identifier.urlhttp://ieeexplore.ieee.org/document/7764699
imec.availabilityPublished - imec


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