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The increasing role of polymers in advanced packaging – from stress buffer layers to wafer level underfills and beyond

dc.contributor.authorMiller, Andy
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorDuval, Fabrice
dc.contributor.authorWang, Teng
dc.contributor.authorSlabbekoorn, John
dc.contributor.authorDe Vos, Joeri
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-23T12:51:29Z
dc.date.available2021-10-23T12:51:29Z
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/27013
dc.sourceIIOimport
dc.titleThe increasing role of polymers in advanced packaging – from stress buffer layers to wafer level underfills and beyond
dc.typeProceedings paper
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorDuval, Fabrice
dc.contributor.imecauthorSlabbekoorn, John
dc.contributor.imecauthorDe Vos, Joeri
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecDe Vos, Joeri::0000-0002-9332-9336
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecMiller, Andy::0000-0001-7048-2242
dc.source.peerreviewyes
dc.source.conference33rd International Conference of Photopolymer Science and Technology - ICPST-33
dc.source.conferencedate22/06/2016
dc.source.conferencelocationChiba, Tokyo Japan
imec.availabilityPublished - imec
imec.internalnotesKeynote Lecture


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