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The increasing role of polymers in advanced packaging – from stress buffer layers to wafer level underfills and beyond
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Authors
Miller, Andy
;
Rebibis, Kenneth June
;
Duval, Fabrice
;
Wang, Teng
;
Slabbekoorn, John
;
De Vos, Joeri
;
Beyne, Eric
Conference
33rd International Conference of Photopolymer Science and Technology - ICPST-33
Title
The increasing role of polymers in advanced packaging – from stress buffer layers to wafer level underfills and beyond
Publication type
Proceedings paper
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