Publication:
The increasing role of polymers in advanced packaging – from stress buffer layers to wafer level underfills and beyond
Date
| dc.contributor.author | Miller, Andy | |
| dc.contributor.author | Rebibis, Kenneth June | |
| dc.contributor.author | Duval, Fabrice | |
| dc.contributor.author | Wang, Teng | |
| dc.contributor.author | Slabbekoorn, John | |
| dc.contributor.author | De Vos, Joeri | |
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.imecauthor | Miller, Andy | |
| dc.contributor.imecauthor | Rebibis, Kenneth June | |
| dc.contributor.imecauthor | Duval, Fabrice | |
| dc.contributor.imecauthor | Slabbekoorn, John | |
| dc.contributor.imecauthor | De Vos, Joeri | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.orcidimec | De Vos, Joeri::0000-0002-9332-9336 | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.contributor.orcidimec | Miller, Andy::0000-0001-7048-2242 | |
| dc.date.accessioned | 2021-10-23T12:51:29Z | |
| dc.date.available | 2021-10-23T12:51:29Z | |
| dc.date.issued | 2016 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/27013 | |
| dc.source.conference | 33rd International Conference of Photopolymer Science and Technology - ICPST-33 | |
| dc.source.conferencedate | 22/06/2016 | |
| dc.source.conferencelocation | Chiba, Tokyo Japan | |
| dc.title | The increasing role of polymers in advanced packaging – from stress buffer layers to wafer level underfills and beyond | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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