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The increasing role of polymers in advanced packaging – from stress buffer layers to wafer level underfills and beyond
Publication:
The increasing role of polymers in advanced packaging – from stress buffer layers to wafer level underfills and beyond
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Date
2016
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Miller, Andy
;
Rebibis, Kenneth June
;
Duval, Fabrice
;
Wang, Teng
;
Slabbekoorn, John
;
De Vos, Joeri
;
Beyne, Eric
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1805
since deposited on 2021-10-23
Acq. date: 2025-12-15
Citations
Metrics
Views
1805
since deposited on 2021-10-23
Acq. date: 2025-12-15
Citations