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Thermal characterization of the inter-die thermal resistance of hybrid Cu/dielectric wafer-to-wafer bonding

dc.contributor.authorOprins, Herman
dc.contributor.authorCherman, Vladimir
dc.contributor.authorWebers, Tomas
dc.contributor.authorSalahouelhadj, Abdellah
dc.contributor.authorKim, Soon-Wook
dc.contributor.authorPeng, Lan
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-23T13:24:05Z
dc.date.available2021-10-23T13:24:05Z
dc.date.issued2016-05
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/27098
dc.sourceIIOimport
dc.titleThermal characterization of the inter-die thermal resistance of hybrid Cu/dielectric wafer-to-wafer bonding
dc.typeProceedings paper
dc.contributor.imecauthorOprins, Herman
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorWebers, Tomas
dc.contributor.imecauthorSalahouelhadj, Abdellah
dc.contributor.imecauthorKim, Soon-Wook
dc.contributor.imecauthorPeng, Lan
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecOprins, Herman::0000-0003-0680-4969
dc.contributor.orcidimecSalahouelhadj, Abdellah::0000-0002-3795-1446
dc.contributor.orcidimecPeng, Lan::0000-0003-1824-126X
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.beginpage1333
dc.source.endpage1339
dc.source.conference15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - ITherm
dc.source.conferencedate31/05/2016
dc.source.conferencelocationLas Vegas, NV USA
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7517703
imec.availabilityPublished - imec


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