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Evaluation of post etch residue cleaning solutions for the removal of TiN hardmask after dry etch of low-k dielectric materials on 45 nm pitch interconnects

dc.contributor.authorPayne, Makonnen
dc.contributor.authorLippy, Steve
dc.contributor.authorLieten, Ruben
dc.contributor.authorKesters, Els
dc.contributor.authorLe, Quoc Toan
dc.contributor.authorMurdoch, Gayle
dc.contributor.authorVega Gonzalez, Victor
dc.contributor.authorHolsteyns, Frank
dc.date.accessioned2021-10-23T13:36:34Z
dc.date.available2021-10-23T13:36:34Z
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/27128
dc.sourceIIOimport
dc.titleEvaluation of post etch residue cleaning solutions for the removal of TiN hardmask after dry etch of low-k dielectric materials on 45 nm pitch interconnects
dc.typeProceedings paper
dc.contributor.imecauthorLieten, Ruben
dc.contributor.imecauthorKesters, Els
dc.contributor.imecauthorLe, Quoc Toan
dc.contributor.imecauthorMurdoch, Gayle
dc.contributor.imecauthorVega Gonzalez, Victor
dc.contributor.imecauthorHolsteyns, Frank
dc.contributor.orcidimecLe, Quoc Toan::0000-0002-0206-6279
dc.source.peerreviewyes
dc.source.beginpage2323
dc.source.endpage236
dc.source.conferenceUltra Clean Processing of Semiconductor Surfaces XIII - UCPSS
dc.source.conferencedate11/09/2016
dc.source.conferencelocationKnokke Belgium
dc.identifier.urlhttp://www.scientific.net/SSP.255.232
imec.availabilityPublished - imec


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