Publication:
Evaluation of post etch residue cleaning solutions for the removal of TiN hardmask after dry etch of low-k dielectric materials on 45 nm pitch interconnects
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1907 since deposited on 2021-10-23
1last month
Acq. date: 2026-01-07
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1907 since deposited on 2021-10-23
1last month
Acq. date: 2026-01-07
Citations