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Evaluation of post etch residue cleaning solutions for the removal of TiN hardmask after dry etch of low-k dielectric materials on 45 nm pitch interconnects
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1903 since deposited on 2021-10-23
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Acq. date: 2025-10-24
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Views
1903 since deposited on 2021-10-23
424item.page.metrics.field.last-week
Acq. date: 2025-10-24
Citations