Publication:
Evaluation of post etch residue cleaning solutions for the removal of TiN hardmask after dry etch of low-k dielectric materials on 45 nm pitch interconnects
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1906 since deposited on 2021-10-23
2last month
Acq. date: 2025-12-15
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Views
1906 since deposited on 2021-10-23
2last month
Acq. date: 2025-12-15
Citations