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Characterization and barrier properties for Cu metallization of tungsten nitride deposited by PECVD using WF6+N2+H2

dc.contributor.authorLi, H.
dc.contributor.authorHeyvaert, Ilse
dc.contributor.authorJin, S.
dc.contributor.authorLanckmans, Filip
dc.contributor.authorBender, Hugo
dc.contributor.authorMaex, Karen
dc.contributor.authorFroyen, L.
dc.date.accessioned2021-10-01T08:28:59Z
dc.date.available2021-10-01T08:28:59Z
dc.date.issued1998
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/2721
dc.sourceIIOimport
dc.titleCharacterization and barrier properties for Cu metallization of tungsten nitride deposited by PECVD using WF6+N2+H2
dc.typeOral presentation
dc.contributor.imecauthorHeyvaert, Ilse
dc.contributor.imecauthorBender, Hugo
dc.contributor.imecauthorMaex, Karen
dc.source.peerreviewno
dc.source.conferenceAdvanced Metallization Conference; October 1998;
dc.source.conferencelocation
imec.availabilityPublished - imec


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