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High-density and low-leakage novel embedded 3D MIM capacitor on Si interposer

dc.contributor.authorRoda Neve, Cesar
dc.contributor.authorDetalle, Mikael
dc.contributor.authorNolmans, Philip
dc.contributor.authorLi, Yunlong
dc.contributor.authorDe Vos, Joeri
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-23T14:17:06Z
dc.date.available2021-10-23T14:17:06Z
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/27224
dc.sourceIIOimport
dc.titleHigh-density and low-leakage novel embedded 3D MIM capacitor on Si interposer
dc.typeProceedings paper
dc.contributor.imecauthorDetalle, Mikael
dc.contributor.imecauthorNolmans, Philip
dc.contributor.imecauthorLi, Yunlong
dc.contributor.imecauthorDe Vos, Joeri
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecLi, Yunlong::0000-0003-4791-4013
dc.contributor.orcidimecDe Vos, Joeri::0000-0002-9332-9336
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.beginpage1
dc.source.endpage4
dc.source.conferenceIEEE International Conference on 3D System Integration - 3DIC
dc.source.conferencedate8/11/2016
dc.source.conferencelocationSan Francisco, CA USA
dc.identifier.urlhttp://ieeexplore.ieee.org/document/7970024/
imec.availabilityPublished - imec


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