Comparison of the electromigration behavior of Al(MgCu) with Al(Cu) and Al(SiCu)

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Authors
Li, Hua; Witvrouw, Ann; Jin, S.; Bender, Hugo; Maex, Karen; Froyen, L.
Conference
Advanced Interconnects and Contact Materials and Processes for Future Integrated Circuits
Title
Comparison of the electromigration behavior of Al(MgCu) with Al(Cu) and Al(SiCu)
Publication type
Proceedings paper
Embargo date
9999-12-31
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