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Toward sub-20nm pitch Fin patterning and integration with DSA

dc.contributor.authorSayan, Safak
dc.contributor.authorMarzook, Taisir
dc.contributor.authorChan, BT
dc.contributor.authorVandenbroeck, Nadia
dc.contributor.authorSingh, Arjun
dc.contributor.authorLaidler, David
dc.contributor.authorAltamirano Sanchez, Efrain
dc.contributor.authorLeray, Philippe
dc.contributor.authorRincon Delgadillo, Paulina
dc.contributor.authorGronheid, Roel
dc.contributor.authorVandenberghe, Geert
dc.contributor.authorClark, William
dc.contributor.authorJuncker, Aurelie
dc.date.accessioned2021-10-23T14:38:26Z
dc.date.available2021-10-23T14:38:26Z
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/27273
dc.sourceIIOimport
dc.titleToward sub-20nm pitch Fin patterning and integration with DSA
dc.typeProceedings paper
dc.contributor.imecauthorChan, BT
dc.contributor.imecauthorVandenbroeck, Nadia
dc.contributor.imecauthorSingh, Arjun
dc.contributor.imecauthorLaidler, David
dc.contributor.imecauthorAltamirano Sanchez, Efrain
dc.contributor.imecauthorLeray, Philippe
dc.contributor.imecauthorRincon Delgadillo, Paulina
dc.contributor.imecauthorGronheid, Roel
dc.contributor.imecauthorVandenberghe, Geert
dc.contributor.orcidimecChan, BT::0000-0003-2890-0388
dc.contributor.orcidimecLaidler, David::0000-0003-4055-3366
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage97790R
dc.source.conferenceAdvances in Patterning Materials and Processes XXXIII
dc.source.conferencedate22/02/2016
dc.source.conferencelocationSan Jose, CA USA
dc.identifier.urlhttp://proceedings.spiedigitallibrary.org/proceeding.aspx?articleid=2510880
imec.availabilityPublished - open access
imec.internalnotesProceedings of SPIE; Vol. 9779


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